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Internship - 3D Printing

The Programme

Part of your life. Part of tomorrow - We make life easier, safer and greener – with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world – we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources. 

What You Will Do

In your new role you will:

  • Assist to identify critical 3D printing materials for relevant projects.
  • Be involved in building prototype for IC packaging application assessment (e.g., ASSY tooling, jigs and fixtures).
  • Manage project feasibility of using 3D printing for IC Packaging Assembly.
  • Support key functions on constructing suitable applications for 3D printing. 

Learning Outcomes:

  • Identify potential application of 3D printing IC package development.
  • Identify areas in high volume manufacturing that can benefit with this technology.
  • Establish internal know-how of 3D printing methods.
  • Serve as basis to compare advantage/ disadvantage of 3D printing versus existing methods.

Required Skills and Abilities

  • On track to attain a diploma in Mechatronics Engineering related study.
  • Know-how in industrial equipment (e.g. wirecut, EDM).
  • Proficient in using AutoCAD or Autodesk inventor or Creo5). 
Closed 4 months ago
Closed 4 months ago
  • Job type:Internships
  • Disciplines:

    Engineering Mechatronics

  • Citizenships:

  • Locations:

    Singapore (Singapore)

  • Closing Date:15th Jul 2021, 6:00 pm

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