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Process Research and Development Engineer

The Programme 

The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data. 
But we can’t do it alone. Today's data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data. 


  • Process development on Wire Bonding, interact Technology, Material & Equipment. 
  • Interface of process, to communicate the requirement from inner/outer customers. 
  • I will generate a new recipe and perform process optimization for the Wire Bonding process. 
  • Review new package process flow and design drawing, maintain design rule and process control documents. 
  • Conduct engineering DOEs and apply statistical analysis methods to solve problems, make decisions with data. 
  • Co-work with NPE/APE to trouble shooting for Wire Bonding process.
  • Other work assigned by team lead.  

Required Skills and Abilities 

  • Master degree or above in Material, Electric, Semiconductor, Mechatronics or engineering related 
  • Skills in DOE design and statistical analysis tools, example: JMP 
  • Be capable of analyzing SEM/FIB/TEM/EDX results, operating is preferred 
  • Basic understanding of Semiconductor assembly process flow & materials property. 
  • Good English communication (written and verbal) skills. 
  • Self-motivated, hardworking, teamwork, and be able to work under high pressure.
Closed 2 months ago
Closed 2 months ago
  • Job type:Graduate Jobs
  • Disciplines:

    Engineering, Research and Development

  • Citizenships:

  • Locations:

    Shanghai (China)

  • Closing Date:4th Jun 2022, 6:00 pm


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